Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate
Autor: | Erer, Ahmet Mustafa, Oguz, Serkan, Türen, Yunus |
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Zdroj: | In Engineering Science and Technology, an International Journal December 2018 21(6):1159-1163 |
Databáze: | ScienceDirect |
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