Fine-grained Ti-Cu microstructures by solid state thermal cycling
| Autor: | Saville, Alec I., Hesmondhalgh, Oliver W., Compton, Natalie A., Thompson, Gabriel A., Sanders, Michael, Klemm-Toole, Jonah, Clarke, Kester D., Fraser, Hamish L., Kaufman, Michael J., Karma, Alain, Clarke, Amy J. |
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| Zdroj: | In Additive Manufacturing 5 August 2023 75 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect