Facile approach to mitigate thermal issues in 3D IC integration using effective FIN orientation
| Autor: | Rakesh, Banothu, Mahindra, Kailaas, Sai Venkat Goud, Marri, Arun Vignesh, N., Padma, Tatiparti, Kumar Panigrahy, Asisa |
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| Zdroj: | In Materials Today: Proceedings 2020 33 Part 7:3085-3088 |
| Databáze: | ScienceDirect |
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