The effect of stability on the thermal conductivity of copper nanofluid at low particle loadings

Autor: Jain, Siddhant, Borah, Rajashree, Saikia, Navojit, Gogoi, Sushmit, Trinavee, Kumari
Zdroj: In Materials Today: Proceedings 2018 5(9) Part 3:20652-20659
Databáze: ScienceDirect