Embedded heat pipe SiC interposer for distributed power devices
| Autor: | Li, Wei, Qian, Wenbing, Zhao, Xiaoliang, Wang, Zhenyu, Wang, Wei, Zhang, Xiaobin, Zhao, Yongzhi |
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| Zdroj: | In Case Studies in Thermal Engineering May 2023 45 |
| Databáze: | ScienceDirect |
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