Modeling Printed Circuit Board Curvature in Relation to Manufacturing Process Steps
| Autor: | Schuerink, G.A., Slomp, M., Wits, Wessel W., Legtenberg, R., Kappel, E.A. |
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| Zdroj: | In Procedia CIRP 2013 9:55-60 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Schuerink, G.A., Slomp, M., Wits, Wessel W., Legtenberg, R., Kappel, E.A. |
|---|---|
| Zdroj: | In Procedia CIRP 2013 9:55-60 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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