Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods
| Autor: | Sabri, Mohd Faizul Mohd, Said, Suhana Binti Mohd, Shnawah, Dhafer Abdulameer |
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| Zdroj: | In Procedia Technology 2015 20:9-14 |
| Databáze: | ScienceDirect |
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