An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures
| Autor: | Wang, Yuexing, Yao, Yao *, Keer, Leon |
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| Zdroj: | In Theoretical and Applied Mechanics Letters January 2020 10(1):33-37 |
| Databáze: | ScienceDirect |
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