Enhancing the reliability of CSP solder joints under thermal cycling conditions through particle swarm optimization of an improved BP neural network
| Autor: | Zhu, Miao, Yang, Xuexia, Sun, Yanxi, Wang, Ze, Liu, Erqiang |
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| Zdroj: | In Microelectronics Journal December 2024 154 |
| Databáze: | ScienceDirect |
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