Plasticisation of Epoxy Resin Transfer Molding Substrate for Fabrication of Interdigital Capacitive Sensors
Autor: | Moghaddam, M. Kahali, Hellmann, J., Lang, W. |
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Zdroj: | In Procedia Engineering 2016 168:1110-1113 |
Databáze: | ScienceDirect |
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