Low Stress Encapsulants? Influence of Encapsulation Materials on Stress and Fracture of Thin Silicon Solar Cells as Revealed by Synchrotron X-ray Submicron Diffraction

Autor: Rengarajan, Karthic Narayanan, Radchenko, Ihor, Illya, Gregoria, Handara, Vincent, Kunz, Martin, Tamura, Nobumichi, Budiman, Arief Suriadi
Zdroj: In Procedia Engineering 2016 139:76-86
Databáze: ScienceDirect