Temporary 0-Level MEMS Packaging Using a Heat Decomposable Sealing Ring
| Autor: | Bogaerts, L., Phommahaxay, A., Gerets, C., Jaenen, P., Van Hoof, R., S.Severi, De Coster, J., Beernaert, R., Rudra, S., Soussan, P., Witvrouw, A. |
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| Zdroj: | In Procedia Engineering 2011 25:1497-1500 |
| Databáze: | ScienceDirect |
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