Kerfless Wafering for Silicon Wafers by Using a Reusable Metal Layer
| Autor: | Schoenfelder, Stephan, Breitenstein, Otwin, Rissland, Sven, De Donno, Remo, Bagdahn, Joerg |
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| Zdroj: | In Energy Procedia 2013 38:942-949 |
| Databáze: | ScienceDirect |
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| Autor: | Schoenfelder, Stephan, Breitenstein, Otwin, Rissland, Sven, De Donno, Remo, Bagdahn, Joerg |
|---|---|
| Zdroj: | In Energy Procedia 2013 38:942-949 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|