Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding
| Autor: | He, Pin-Syuan, Tu, Chun-Wei, Shie, Kai-Cheng, Liu, Chien-Yu, Tsai, Hsin-Yu, Tran, Dinh-Phuc, Chen, Chih |
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| Zdroj: | In Journal of Electroanalytical Chemistry 15 September 2024 969 |
| Databáze: | ScienceDirect |
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