Improving accuracy of filling performance prediction in microvia copper electroplating

Autor: Moon, Jeong-Ho a, Shin, Jaewook a, b, Kim, Tae-Hee a, Song, DongHoon a, Cho, EunAe a, ⁎
Zdroj: In Journal of Electroanalytical Chemistry 15 August 2020 871
Databáze: ScienceDirect