Surface evolution mechanism for atomic-scale smoothing of Si via atmospheric pressure plasma etching
| Autor: | Wu, Bing, Yi, Rong, Ding, Xuemiao, Chiu, Tom, He, Quanpeng, Deng, Hui |
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| Zdroj: | In Journal of Manufacturing Processes 26 December 2024 132:353-362 |
| Databáze: | ScienceDirect |
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