Fan-out panel-level package warpage and reliability analyses considering the fabrication process
| Autor: | Liang, Chia-Wei, Sung, Yu-Chi, Hwang, Sheng-Jye, Shih, Ming-Hsiang, Liao, Wen-Hsiang, Lin, Te-Hsun, Yang, Dong-Yan |
|---|---|
| Zdroj: | In Journal of Manufacturing Processes 15 June 2024 119:649-665 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect