Cryogenic and ultrasonic-assisted micro-drilling of printed circuit boards using high-frequency-amplitude spindle
| Autor: | Xu, Moran, Chen, Shuo, Kurniawan, Rendi, Li, Changping, Ali, Saood, Liu, Sijia, Teng, Hanwei, Han, Pil Wan, Ko, Tae Jo |
|---|---|
| Zdroj: | In Journal of Manufacturing Processes 15 June 2024 119:911-928 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect