Study on material removal mechanism of sapphire wafer with CeO2 coated diamond composite abrasives via green polishing
| Autor: | Xu, Yongchao, Zhao, Guangen, Wang, Qianting, Zhan, Youji, Chen, Bingsan |
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| Zdroj: | In Journal of Manufacturing Processes 28 April 2023 92:412-421 |
| Databáze: | ScienceDirect |
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