Chemical mechanical polishing of silicon wafers using developed uniformly dispersed colloidal silica in slurry
| Autor: | Xie, Wenxiang, Zhang, Zhenyu, Wang, Li, Cui, Xiangxiang, Yu, Shiqiang, Su, Hongjiu, Wang, Shudong |
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| Zdroj: | In Journal of Manufacturing Processes 24 March 2023 90:196-203 |
| Databáze: | ScienceDirect |
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