A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints
| Autor: | Ismail, N., Atiqah, A., Jalar, A., Bakar, M.A., Rahim, R.A.A., Ismail, A.G., Hamzah, A.A., Keng, L.K. |
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| Zdroj: | In Journal of Manufacturing Processes November 2022 83:68-85 |
| Databáze: | ScienceDirect |
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