Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design
| Autor: | Veselý, Petr, Dušek, Karel, Froš, Denis |
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| Zdroj: | In Journal of Manufacturing Processes September 2022 81:696-706 |
| Databáze: | ScienceDirect |
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