Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
| Autor: | Inoue, Fumihiro *, Podpod, Arnita, Peng, Lan, Phommahaxay, Alain, Rebibis, Kenneth June, Uedono, Akira, Beyne, Eric |
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| Zdroj: | In Journal of Manufacturing Processes October 2020 58:811-818 |
| Databáze: | ScienceDirect |
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