Wafer-level Vacuum Packaged X and Y axis Gyroscope Using the Extended SBM Process for Ubiquitous Robot applications
| Autor: | Choi, Byoung-Doo, Paik, Seung-Joon, Lee, Sangmin, Ko, Hyoungho, Yoo, Kwangho, Kim, Nam-Kuk, Cho, Dong-il “Dan” |
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| Zdroj: | In IFAC Proceedings Volumes 2008 41(2):4418-4423 |
| Databáze: | ScienceDirect |
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