Copper Electrodeposition on Polyimide Substrate Using Polyaniline Film as a Seed Layer for Metallization of Flexible Devices
| Autor: | Lee, Dohyeun, Lim, Taeho, Lim, Hana, Kim, Hyun-Jong, Kwon, Oh Joong |
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| Zdroj: | In International Journal of Electrochemical Science December 2018 13(12):11829-11838 |
| Databáze: | ScienceDirect |
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