Influence of EDTA/THPED Dual-Ligand on Copper Electroless Deposition
| Autor: | Jianhong, Lu, Yun, Jimmy, Haiping, Lei, Jiguo, Tu, Shu-qiang, Jiao |
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| Zdroj: | In International Journal of Electrochemical Science June 2018 13(6):6015-6026 |
| Databáze: | ScienceDirect |
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