Interweaved filler network in epoxy resin with reduced interface thermal resistance via in-situ high-temperature “welding” for significantly improved thermal conductivity

Autor: Lu, Yani, Xu, Xinwei, Li, Li, Dong, Jiufeng, Hu, Renchao, Chen, Wenjin, Liu, Weishu, Wang, Hong
Zdroj: In Chemical Engineering Journal 15 August 2024 494
Databáze: ScienceDirect