Enhanced copper adsorption by DTPA-chitosan/alginate composite beads: Mechanism and application in simulated electroplating wastewater

Autor: Huang, Yanjun, Wu, Hailing, Shao, Taikang, Zhao, Xia, Peng, Hong, Gong, Yuefa, Wan, Huihai
Zdroj: In Chemical Engineering Journal 1 May 2018 339:322-333
Databáze: ScienceDirect