Preparation of heat-resistant poly(amide-imide) films with ultralow coefficients of thermal expansion for optoelectronic application
| Autor: | Bai, Lan, Zhai, Lei, He, Minhui, Wang, Changou, Mo, Song, Fan, Lin |
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| Zdroj: | In Reactive and Functional Polymers August 2019 141:155-164 |
| Databáze: | ScienceDirect |
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