Parametric studies of nanoscale through-silicon vias under the reflow in advanced packaging
| Autor: | Wu, Luchao a, Liu, Ziyu b, ⁎⁎, Wang, Jun a, c, ⁎ |
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| Zdroj: | In Materials Science in Semiconductor Processing January 2025 185 |
| Databáze: | ScienceDirect |
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