Roughness control in the processing of 2-inch polycrystalline diamond films on 4H-SiC wafers
Autor: | Hu, Xiufei, Wang, Ziang, Wang, Yingnan, Han, Saibin, Zhang, Xiaoyu, Peng, Yan, Ge, Lei, Xu, Mingsheng, Wang, Xiwei, Han, Jisheng, Xu, Xiangang |
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Zdroj: | In Materials Science in Semiconductor Processing December 2024 184 |
Databáze: | ScienceDirect |
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