Roughness control in the processing of 2-inch polycrystalline diamond films on 4H-SiC wafers

Autor: Hu, Xiufei, Wang, Ziang, Wang, Yingnan, Han, Saibin, Zhang, Xiaoyu, Peng, Yan, Ge, Lei, Xu, Mingsheng, Wang, Xiwei, Han, Jisheng, Xu, Xiangang
Zdroj: In Materials Science in Semiconductor Processing December 2024 184
Databáze: ScienceDirect