Elimination of splash damage for smaller scribe widths in next-gen memory devices via stealth dicing
| Autor: | Lim, Dao Kun, Vempaty, Venkata Rama Satya Pradeep, Yu, Aibin, Sim, Wen How, Singh, Harjashan Veer |
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| Zdroj: | In Materials Science in Semiconductor Processing October 2024 181 |
| Databáze: | ScienceDirect |
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