Effect of grain size on tungsten material removal rate during chemical mechanical planarization process
| Autor: | Liu, Haoqi, Yang, Tao, Zhang, Yue, Lu, Yihong, Gao, Jianfeng, Li, Junfeng, Luo, Jun |
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| Zdroj: | In Materials Science in Semiconductor Processing October 2024 181 |
| Databáze: | ScienceDirect |
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