Backside metallization affects residual stress and bending strength of the recast layer in laser-diced Si

Autor: Ziegelwanger, T. a, ⁎, Reisinger, M. b, Matoy, K. c, Medjahed, A.A. d, Zalesak, J. e, Gruber, M. f, Meindlhumer, M. a, Keckes, J. a
Zdroj: In Materials Science in Semiconductor Processing October 2024 181
Databáze: ScienceDirect