Temporary polymer bonding for the manufacturing of thin wafers: An innovative low temperature process

Autor:	Montméat, P., Bally, L., Dechamp, J., Enot, T., Fournel, F.
Zdroj:	In Materials Science in Semiconductor Processing 1 March 2021 123
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect