Discharge cutting technology for specific crystallographic planes of monocrystalline silicon
Autor: | Tian, Ye, Qiu, Mingbo, Liu, Zhidong, Tian, Zongjun, Huang, Yinhui |
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Zdroj: | In Materials Science in Semiconductor Processing November 2014 27:546-552 |
Databáze: | ScienceDirect |
Externí odkaz: |