Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
| Autor: | Liu, Yang, Chen, Chuantong, Wang, Ye, Zhang, Zheng, Liu, Ran, Ueshima, Minoru, Ota, Ichiro, Nishikawa, Hiroshi, Nishijima, Masahiko, Nakayama, Koji S., Suganuma, Katsuaki |
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| Zdroj: | In Composites Part B 15 July 2024 281 |
| Databáze: | ScienceDirect |
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