Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives
| Autor: | Jee, Sung Min, Ahn, Cheol-Hee, Park, Jong Hyuk, Kim, Tae Ann, Park, Min |
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| Zdroj: | In Composites Part B 1 December 2020 202 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect