Covalent bond-assisted continuous interface structure for high thermal conductive polyimide composite films
| Autor: | Wang, Fan, Dong, Xiaodi, Liu, Guangyi, Wan, Baoquan, Gao, Jinghui, Liu, Baixin, Zha, Jun-Wei |
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| Zdroj: | In Composites Part A October 2024 185 |
| Databáze: | ScienceDirect |
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