Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
| Autor: | Yao, Yifan, Gusak, A.M., Chen, Chih, Liu, Yingxia, Tu, K.N. |
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| Zdroj: | In Scripta Materialia 1 September 2024 250 |
| Databáze: | ScienceDirect |
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