The effect of interface stress on the grain boundary grooving in nanomaterials: Application to the thermal degradation of Cu/W nano-multilayers

Autor: Druzhinin, A.V., Cancellieri, C., Jeurgens, L.P.H., Straumal, B.B.
Zdroj: In Scripta Materialia 1 July 2021 199
Databáze: ScienceDirect