Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys
| Autor: | Kim, Gyuseok, Chai, Xuzhao, Yu, Le, Cheng, Xuemei, Gianola, Daniel S. |
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| Zdroj: | In Scripta Materialia October 2016 123:113-117 |
| Databáze: | ScienceDirect |
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