Silver oxalate-based solders: New materials for high thermal conductivity microjoining
| Autor: | Kiryukhina, K., Le Trong, H., Tailhades, Ph., Lacaze, J., Baco, V., Gougeon, M., Courtade, F., Dareys, S., Vendier, O., Raynaud, L. |
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| Zdroj: | In Scripta Materialia April 2013 68(8):623-626 |
| Databáze: | ScienceDirect |
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