Permeation of niobium through grain boundaries in copper
| Autor: | Sheu, Emmeline, Liu, Tung Yan, Williams, Darrick J., Baldwin, Jon K., Demkowicz, Michael J. |
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| Zdroj: | In Acta Materialia 1 August 2024 274 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Sheu, Emmeline, Liu, Tung Yan, Williams, Darrick J., Baldwin, Jon K., Demkowicz, Michael J. |
|---|---|
| Zdroj: | In Acta Materialia 1 August 2024 274 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect