Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering
| Autor: | Tan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D., Nogita, Kazuhiro |
|---|---|
| Zdroj: | In Acta Materialia March 2022 226 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect