Void growth in copper during high-temperature power-law creep
| Autor: | Dzieciol, K., Borbély, A., Sket, F., Isaac, A., Di Michiel, M., Cloetens, P., Buslaps, Th., Pyzalla, A.R. |
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| Zdroj: | In Acta Materialia 2011 59(2):671-677 |
| Databáze: | ScienceDirect |
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