Enhancing the high-temperature thermal evacuation of Cf/C-Mo30Cu joint via grooving 3D heat transfer interface
| Autor: | Si, Xiaoqing, Xue, Pengpeng, Li, Xin, Zhang, Baiqi, Xue, Yuewen, Li, Chun, Qi, Junlei, Cao, Jian |
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| Zdroj: | In Applied Thermal Engineering 15 March 2024 241 |
| Databáze: | ScienceDirect |
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