Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap
| Autor: | Kim, Kiwan, Kong, Daeyoung, Kim, Yunseo, Jang, Bongho, Cho, Jungwan, Kwon, Hyuk-Jun, Lee, Hyoungsoon |
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| Zdroj: | In Applied Thermal Engineering 15 March 2024 241 |
| Databáze: | ScienceDirect |
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