A novel integrated flat thermosyphon heat sink for energy-efficient chip-level thermal management in data centers
| Autor: | Dhanalakota, Praveen, Dileep, Hemanth, Malla, Laxman Kumar, Mahapatra, Pallab Sinha, Pattamatta, Arvind |
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| Zdroj: | In Applied Thermal Engineering 5 January 2024 236 Part B |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect