Thermoelectric hotspot cooling using thermally conductive fillers
| Autor: | Park, Sang J., Park, Junyoung, Bang, Ki Mun, Lee, Jung Min, Park, Woosung, Ziolkowski, Pawel, Jin, Hyungyu |
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| Zdroj: | In Applied Thermal Engineering September 2023 232 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect